NextFin News — Samsung Electronics has allocated more than half of its 4-nanometer foundry capacity to production of base dies for sixth-generation high-bandwidth memory, or HBM4, according to industry sources cited by Korean media.
Sources put the share at 50% to 60% of 4nm output, with production lines at the Pyeongtaek campuses running at full capacity. The allocation is intended to support growing demand for HBM4 from major customers including Nvidia, Broadcom and AMD in the second half of the year.
Samsung began mass production of HBM4 earlier this year and is expanding wafer starts to meet expected supply needs. The company has forecast that HBM4 will account for a substantial portion of its overall HBM sales in the second half.
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